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HAD826HD
Plane-type High-speed Die Bonder
Cycle: 200ms
It is compatible with flip-chip、COB、soft filament etc. types of holders
Product Features
1. It is the best choice for full-automation die bond of planar LED lights;
2. High-speed die bond(200ms/piece, 16K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
3. Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies;
4. Suction receiving way with the left loading and right receiving method made it convenient to operate;
5. Linear motor is applied to drive bond head;
6. New deep contact measurement system control arm is applied; solving the bonding issues caused by the non-uniform height of PCB or holder effectively;
7. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
8. Programmed control constant-temperature double adhesive dispensing system is also applied;
9. Vacuum die missing testing technology is adopted;
10. IPC will control the operation of equipment, simplifying the operation of automation equipment.
Specifications
and Parameters
1.系统功能/System Function
4、吸晶摆臂机械手系统/
Die Bonder’s Swing Arm-and-hand system
生产周期/Production Cycle
200ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)
吸晶摆臂/Swing Arm of Die Bonder
90°可旋转固晶(Rotatable Die Bond)
XY位置精度/Accuracy
±1.5mil(±0.038mm）
吸晶压力/Die Bond Pressure
可调20g—250g(Adjustable)
芯片旋转/Die Rotation
±3°
5.送料工作平台/Loading Workbench
2.芯片XY工作台/Die XY Workbench
行程范围/Range of Stroke
支架长/Length：130mm-620mm.
支架宽/Width：30mm-73mm（每一款支架需定制一款底板）A customized substrate is needed to
each type of holder
芯片尺寸/Die Dimensions
5mil×5mil-80mil×80mil
XY分辨率/XY Resolution
0.02mil（0.5μm）
最大芯片环尺寸
/Max. Die Ring Size
6″（152mm）外径(External Diameter)
6.所需设施/Facilities Needed
最大芯片面积尺寸/Max. Die Area
4.7″（119mm）扩张后(Expanded)
电压/频率/Voltage/Frequency
220V AC±5%/50HZ
分辨率/Resolution Ratio
0.04mil (1μm)
压缩空气/Compressed Air
0.5MPa（MIN）
顶针Z高度行程/Thimble Z Height
Stroke
80mil（2mm）
额定功率/Rated Power
700W
3.图像识别系统/Image Recognition System
耗气量/Gas Consumption
5L/min
灰阶度/Grey Scale
256级灰度(Level Grey)
7.体积及重量/Volume and Weight
分辨率/Resolution
512×512像素(Pixels)
长x宽x高/
Length x Width x Height
1965×1185×1740mm
图像识别精准度/Image Recognition Accuracy
±0.025mil@50mil观测范围(Observation Range)
重量/Weight
1060kg
(0.13mm*0.13mm-2mm*2mm)
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