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HAD203
    Publish time 2019-07-18 16:00    

HAD203

Cycle: 65ms

Plane-type High-speed Die Bonder

It is compatible with solder paste printed SMD diodeaudionoptocoupler tube and mobile-phone backlight etc.

 

Product Features

1.      International leading double die bond and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Crystal frame automatic correction chip structure is also applied

5.      Vacuum die missing testing technology is adopted;

6.      Automatic loading and unloading system is applied to saving the time of reloading;

7.      Automatic installing & uninstalling crystal rings is applied to improve the production efficiency largely;

8.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.

 

Specifications and Parameters

 

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

65ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

双摆臂120°可旋转固晶(Rotatable Die Bond with Double Swing Arms)

XY位置精度/Accuracy (带芯片校正功能/ With Die Correcting Feature)

±1mil(±0.025mm

吸晶压力/Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±2°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/Range of Stroke

75mmX300mm

芯片尺寸/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

XY分辨率/XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

±15°

支架长度/Length

100 ~ 300mm

最大芯片环尺寸/Max. Die Ring Size

6″与8″可选(Optional)

支架宽度/Width

48~ 75mm

最大芯片面积尺寸/Max. Die Area

6119mm)、8165mm

7.所需设施/Facilities Needed

分辨率/Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/Compressed Air

4-6kg/cm?

额定功率/Rated Power

650W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

156×128×180cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1250kg

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