It is compatible with
audion, transmitting/receiving tube and diode holders.
Product Features
1.Linear motor will drive the die to search corresponding platform(X/Y) and
corresponding loading platform (B/C);
2.Linear motor is applied to drive bond head;
3.Vacuum die missing testing technology is adopted;
4.Programmed control constant-temperature adhesive dispensing system is also
applied;
5.Free-loading
magazine is applied to improve the production efficiency largely;
6.Precise die bond location and excellent compatibility will guarantee the
back-end processing;
7.IPC will control the operation of equipment, simplifying the operation of
automation equipment;
8.Sophisticated equipment will help improve your enterprise’s production
efficiency and reduce relevant costs so as to provide effective guarantee and
enhance your enterprise’s competitiveness.
Specifications
and Parameters
1.系统功能/System Function
4、吸晶摆臂机械手系统/
Die Bonder’s Swing Arm-and-hand system
生产周期/Production Cycle
200ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)
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