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HAD308
    Publish time 2019-07-18 17:05    

HAD308

Plane-type High-speed Die Bonder

Cycle: 80ms

It is compatible with SMDCOB diodeaudionflip-chip etc.

 

Product Features

1.      International leading double die bond, double adhesive dispensing and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Crystal frame automatic correction chip structure is also applied

5.      Programmed control constant-temperature adhesive dispensing system is also applied;

6.      Vacuum die missing testing technology is adopted;

7.      Loading by free-loading magazine with paper suction function (eliminate the frame release paper), to largely improve the production efficiency;

8.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

9.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

10.  Precise die bond location and excellent compatibility will guarantee the back-end processing.

 

Specifications and Parameters

 

1.系统功能/System Function

4、吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

80ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

90°可旋转固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1mil(±0.025mm

吸晶压力/Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±1°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/Range of Stroke

300mm*75mm

芯片尺寸/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

XY分辨率/XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

±15°

支架长度/Length

145mm ~ 300mm

最大芯片环尺寸/Max. Die Ring Size

8″(210mm)外径  铁环(External Diameter) Iron Ring

支架宽度/Width

40mm~ 75mm

最大芯片面积尺寸/Max. Die Area

6.5″(165mm)扩张后(Expanded)

7.所需设施/Facilities Needed

分辨率/Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

950W

3.图像识别系统/Image Recognition System

耗气量/Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656 x 492像素(Pixels)

xx/Length x Width x Height

175 x125 x185cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1470kg

 


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