HAD826P(平面式高速固晶機)
(週期:140ms)
適用於倒裝、COB、SMD、3528、2121及5050等各類支架
一、機型特性
1.平面式LED燈全自動固晶的最佳選擇;
2.高速固晶(140ms/顆,每小時產量為25K)、精准的自動化設備為企業提高生產效率、降低成本提供了有效保障,從而切實有效地提高了企業競爭力;
3.精准的固晶位置及優良的一致性為後道工序提供了先天的保障;
4.吸抓一體和料盒推支架兩種方式相容進料,可迴圈式料盒收料;同時採用左進料和右收料的方式,方便操作人員操作機台;
6.採用全新接觸式深測系統控制擺臂;
7.線性電機驅動晶片搜尋平臺(X/Y)與固晶平臺(B/C)
8.採用可程式恒溫點膠系統;
9.採用真空漏晶檢測;
10. 工控機控制設備運行,簡化了自動化設備的操作;
HAD826P
Plane-type High-speed Die Bonder
Cycle: 140ms
It is compatible with flip-chip、COB、SMD、3528、2121 and 5050 etc. types of holders
Product Features
1. It is the best choice for full-automation die bond of planar LED lights;
2. High-speed die bond(140ms/ piece, 25K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
3. Precise die bond location and excellent compatibility will guarantee the back-end processing;
4. Two ways of suction and grasping united and the magazine push holders are compatible to load, and receiving by the circulating magazine; meanwhile, the left loading and right receiving method made it convenient to operate;
5. Linear motor is applied to drive bond head;
6. New deep contact measurement system control arm is applied;
7. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
8. Brand-new constant-temperature adhesive dispensing system is also applied;
9. Vacuum die missing testing technology is adopted;
10. IPC will control the operation of equipment, simplifying the usage of automation equipment.
二、規格參數
Specifications and Parameters
1.系統功能/System Function
4、吸晶擺臂機械手系統/
Die
Bonder’s Swing Arm-and-hand system
生產週期/Production Cycle
140ms(取決於晶片尺寸及支架)(Depending
On Die Size And Holder)
吸晶擺臂/Swing Arm of Die Bonder
90°可旋轉固晶(Rotatable Die Bond)
XY位置精度/Accuracy
±1mil(±0.025mm)
吸晶壓力/Die Bond Pressure
可調20g—250g(Adjustable)
晶片旋轉/Die Rotation
±3°
5.送料工作平臺/Loading
Workbench
2.晶片XY工作臺/Die XY
Workbench
行程範圍/Range of Stroke
支架長/Length:130mm-260mm.
支架寬/Width:50mm-130mm.
晶片尺寸
/Die Dimensions
5mil×5mil-80mil×80mil
XY解析度/XY Resolution
0.02mil(0.5μm)
最大晶片環尺寸/Max. Die Ring Size
6″(152mm)外徑(External Diameter)
6.所需設施/Facilities
Needed
最大晶片面積尺寸/Max. Die Area
4.7″(119mm)擴張後(Expanded)
電壓/頻率/Voltage/Frequency
220V AC±5%/50HZ
解析度/Resolution Ratio
0.04mil (1μm)
壓縮空氣/Compressed Air
0.5MPa(MIN)
頂針Z高度行程/Thimble Z Height Stroke
80mil(2mm)
額定功率/Rated Power
700W
3.圖像識別系統/Image
Recognition System
耗氣量/Gas Consumption
5L/min
灰階度/Grey Scale
256級灰度(Level Grey)
7.體積及重量/Volume
and Weight
解析度/Resolution
656×492圖元(Pixels)
長x寬x高/
Length x Width x Height
140×97×180cm
圖像識別精准度/Image Recognition Accuracy
±0.025mil@50mil觀測範圍(Observation Range)
重量/eight
874kg
(0.13mm*0.13mm-2mm*2mm)
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