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GT836M
    發布時間: 2019-07-23 16:00    


GT836M
(週期:
180ms

適用於數碼、點陣、大功率、COBSMD

一、機型特性

1.平面式LED燈全自動固晶的最佳選擇;

2.高速固晶(180ms/顆,每小時產量為20K)、精准的自動化設備為企業提高生產效率、降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

3. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障;

4.採用直驅電機驅動邦頭;

5.採用全新接觸式探測系統控制擺臂,有效解決了PCB板或支架高度不一致而導致的固晶問題

6.採用線性電機驅動晶片搜尋平臺(X/Y)與固晶平臺(B/C

7.採用可程式恒溫點膠系統;

8.採用真空漏晶檢測;

9. 工控機控制設備運行,簡化了自動化設備的操作;

 

GT836M

Plane-type High-speed Die Bonder

Cycle: 180ms

It is compatible with digital products, dot matrix, high power, COB, and SMD etc.

 

Product Features

1.        It is the best choice for full-automation die bond of planar LED lights;

2.        High-speed die bond(180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.        Precise die bond location and excellent compatibility will guarantee the back-end processing;

4.        Linear motor is applied to drive bond head;

5.        New touch-type deep detection system is applied to control the swing arm, solving the bonding issues caused by the non-uniform height of PCB or holder effectively;

6.        Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

7.        Programmed control constant-temperature adhesive dispensing system is also applied;

8.        Vacuum die missing testing technology is adopted;

9.        IPC will control the operation of equipment, simplifying the operation of automation equipment.

二、規格參數

Specifications and Parameters

 

1.系統功能/System Function

4、吸晶擺臂機械手系統/

Die Bonder’s Swing Arm-and-hand system

生產週期/Production Cycle

180ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶擺臂/Swing Arm of Die Bonder

90°可旋轉固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1.5mil(±0.038mm

吸晶壓力/Die Bond Pressure

可調20g250g(Adjustable)

晶片旋轉/Die Rotation

±3°

5.送料工作平臺/Loading Workbench

2.晶片XY工作臺/Die XY Workbench

行程範圍/Range of Stroke

155mm*255mm

晶片尺寸/Die Dimensions

4mil×4mil-80mil×80mil
(0.1mm*0.1mm-2mm*2mm)

XY解析度/XY Resolution

0.02mil0.5μm

最大晶片環尺寸/Max. Die Ring Size

6″(152mm)外徑(External Diameter)

6.所需設施/Facilities Needed

最大晶片面積尺寸/Max. Die Area

4.7″(119mm)擴張後(Expanded)

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

解析度/Resolution Ratio

0.04mil  (1μm)

壓縮空氣/Compressed Air

0.5MPaMIN

頂針Z高度行程/Thimble Z Height Stroke

80mil2mm

額定功率/Rated Power

700W

3.圖像識別系統/Image Recognition System

耗氣量/Gas Consumption

5L/min

灰階度/Grey Scale

256級灰度(Level Grey)

7.體積及重量/Volume and Weight

解析度/Resolution

512×512圖元(Pixels)

xx/Length x Width x Height

93×93×180cm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

重量/Weight

630kg

 

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