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HAD810
適用於IC類框架
一、機型特性
1.直線電機驅動的雙點膠系統；
2.高精度直線驅動固晶綁頭,音圈扭力環精確控制固晶壓力；
3.高精度搜尋晶片平臺，伺服電機驅動晶片角度矯正系統，配備自動擴膜系統；
4.採用點膠獨立控制系統，膠量控制更加精確；
5.採用真空漏晶檢測；
6.工控機控制設備運行，簡化了自動化設備的操作；
7.精准的自動化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；
HAD810
Automatic Plane-type Die Bonder
Cycle: 220ms
It is compatible with IC frame
1. Linear motor is applied to drive double adhesive dispensing bond head;
2. High precision linear driving die bond tieback, voice coil torsion loop controls die bond pressure accurately;
3. High-precision die platform searching, servo motor driving die angle correction system, equipped with automatic film expansion system;
4. A separate dispensing control system is adopted to make a precisely control of dispensing amount;
5. Vacuum die missing testing technology is adopted;
6. IPC will control the operation of equipment, simplifying the operation of automation equipment;
7. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.
二、規格參數
Specifications and Parameters
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1.系統功能/System Function |
4、吸晶擺臂機械手系統/ Die Bonder’s Swing Arm-and-hand system |
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生產週期/Production Cycle |
220ms（取決於晶片與支架）(Depending On Die Size And Holder) |
吸晶擺臂 /Die Bonder’s Swing Arm |
150mm 直線電機往復固/linear motor reciprocate die bonding |
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XY位置精度/Accuracy |
±0.6mil(±0.015mm） |
吸晶壓力 /Die Bond Pressure |
可調20g—250g(Adjustable) |
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不作上視式檢查Accuracy (Up-look inspection) |
±1mil（±0.025mm） |
5.適用支架尺寸/Suitable Holder’s Size |
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晶片旋轉/Die Rotation |
±1° |
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2.晶片XY工作臺/Die XY Workbench |
支架長度/Length |
110mm ~ 280mm |
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晶片尺寸/Die Dimensions |
5mil×5mil-100mil×100mil 小於12mil晶片需考慮膠杯沾膠 (Consider the glue disk dispensing way if the die is lesser than 12mil) |
支架寬度/Width |
25mm ~ 110mm |
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晶片最大角度修正/ Max. Angle Correction |
360° |
6.所需設施/Facilities Needed |
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適用晶片環尺寸/ Max. Die Ring Size |
外徑(External Diameter):296mm 內徑(Inner Diameter)：254mm |
電壓/頻率/Voltage/Frequency |
220V AC±5%/50HZ |
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最大晶片面積尺寸 /Max. Die Area |
直徑205mm（擴張後）(Expanded) |
壓縮空氣/Compressed Air |
0.5MPa（MIN） |
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解析度/Resolution Ratio |
0.04mil (1μm) |
額定功率/Rated Power |
1820W |
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頂針Z高度行程/Thimble Z Height Stroke |
80mil（2mm） |
耗氣量/Gas Consumption |
5L/min |
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適用鐵環/晶圓 Suitable Iron ring/ wafer |
標配 10寸鐵環8寸晶圓/Standard Equipped with 10″Iron Ring and 8″Wafer |
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可相容 8寸鐵環6寸晶圓/Compatible with 8″Iron Ring and 6″Wafer |
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3.圖像識別系統/Image Recognition System |
適用針筒規格 Suitable Barrel Spec. |
標配10CC(可相容5CC和3CC) /Standard Equipped with 10CC, (Compatible with 5CCand 3CC) |
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灰階度/Grey Scale |
256級灰度(Level Grey) |
7.體積及重量/Volume and Weight |
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解析度/Resolution |
656×492圖元(Pixels) |
長x寬x高/ Length x Width x Height |
205×135×190cm |
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圖像識別精准度/Image Recognition Accuracy |
±0.025mil@50mil觀測範圍(Observation Range) |
重量/Weight |
1800kg |
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