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HAD310N
    Publish time 2019-07-23 16:07    


HAD310N
泛用型平面固晶機

週期:200ms

適用于三極管,發射接收管,二極體支架

一、機型特性

1.採用線性電機驅動搜尋晶片平臺(X/Y)與送料平臺(B/C,確保定位精准度;

2.採用直驅電機驅動邦頭;

3.採用真空漏晶檢測;

4.採用可程式恒溫點膠系統;

5.採用免裝料盒上料方式,有效提高了生產效率;

6. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障;

7.工控機控制設備運行,簡化了自動化設備的操作;

8.精准的自動化設備為企業提高生產效率,降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

 

HAD310N

Universal Plane-type Die Bonder

Cycle: 200ms

It is compatible with audion, transmitting/receiving tube and diode holders.

 

Product Features

1.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

2.      Linear motor is applied to drive bond head;

3.      Vacuum die missing testing technology is adopted;

4.      Programmed control constant-temperature adhesive dispensing system is also applied;

5.      Free-loading magazine is applied to improve the production efficiency largely;

6.      Precise die bond location and excellent compatibility will guarantee the back-end processing;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance your enterprise’s competitiveness.

 

 

二、規格參數

Specifications and Parameters

                                                                            

1.系統功能/System Function

4、吸晶擺臂機械手系統/

Die Bonder’s Swing Arm-and-hand system

生產週期/Production Cycle

200ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶擺臂/Swing Arm of Die Bonder

90°旋轉固晶(Rotatable Die Bond)

XY位置精度/Accuracy

±1.5mil(±0.038mm

吸晶壓力/Die Bond Pressure

可調20g250g(Adjustable)

晶片旋轉/Die Rotation

±3°

5.適用支架尺寸/Suitable Holder’s Size

2.晶片XY工作臺/Die XY Workbench

支架長度/Length

150mm ~ 180mm

晶片尺寸/Die Dimensions

10mil×10mil-100mil×100mil
(0.25mm*0.25mm-2.54mm*2.54mm)

支架寬度/Width

24mm~ 60mm

最大晶片環尺寸/Max. Die Ring Size

8212mm)外徑(External Diameter)

6.所需設施/Facilities Needed

最大晶片面積尺寸/Max. Die Area

6.5165mm)擴張後(Expanded)

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

解析度/Resolution Ratio

0.04mil  (1μm)

壓縮空氣/Compressed Air

0.5MPaMIN

頂針Z高度行程/Thimble Z Height Stroke

80mil2mm

額定功率/Rated Power

700W

耗氣量/Gas Consumption

5L/min

3.圖像識別系統/Image Recognition System

7.體積及重量/Volume and Weight

灰階度/Grey Scale

256級灰度(Level Grey)

解析度/Resolution

640×480圖元(Pixels)

xx高(cm/Length x Width x Height

115×92×200cm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

重量/Weight

550kg

 

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