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公司理念:創新、高效、和諧、務實
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產品分類
HAD300A-R, HAD300A-L
    發布時間: 2019-07-23 16:08    


HAD300A-R, HAD300A-L
(三頭平面式高速固晶機)

(單頭週期:170ms

適用於SMD02010102121,30142835,5050 

一、機型特性

1.採用國際領先的三固晶,三點膠,三晶片搜尋系統;

2.採用直驅電機驅動邦頭

3.採用線性電機驅動搜尋晶片平臺(X/Y)與送料平臺(B/C

4.採用可程式恒溫點膠系統;

5.採用真空漏晶檢測;

6.採用自動式上下料,減少換料時間;

7. 工控機控制設備運行,簡化了自動化設備的操作;

8.精准的設備化設備為企業提高生產效率,降低成本提供了有效保障,從而切實有效地提高了企業競爭力;

9. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障,同時固晶位置精準確保LED燈光斑的品質,良好焊接及漂亮光斑再加上優良晶片就構成了高品質LED產品;

10. GS300A-R 是右進料左出料, GS300A-L 是左進料右出料。

 

 

HAD300A-R, HAD300A-L

Triple-head Plane-type High-speed Die Bonder

Single Head Cycle: 170ms

It is compatible with SMD0201010 212130142835 and 5050 etc.

 

Product Features

1.      International leading triple die bond, triple adhesive dispensing and triple die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Programmed control constant-temperature double adhesive dispensing system is also applied;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic loading and unloading system is applied to saving the time of reloading;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

9.      Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies;

10.  GS300A-R is right loading and left unloading, the GS300A-L is left loading and right unloading.

 

二、規格參數

Specifications and Parameters

1.系統功能/System Function

4、吸晶擺臂機械手系統/

Die Bonder’s Swing Arm-and-hand system

生產週期/Production Cycle

170ms(取決於晶片尺寸及支架(Depending On Die Size And Holder)

吸晶擺臂/Swing Arm of Die Bonder

360°可旋轉固晶 (Rotatable Die Bond)

XY位置精度/Accuracy

±1.0mil(±0.025mm

吸晶壓力/Die Bond Pressure

可調20g250g(Adjustable)

晶片旋轉/Die Rotation

±3°

5.送料工作平臺/Loading Workbench

2.晶片XY工作臺/Die XY Workbench

行程範圍/Range of Stroke

170mm*75mm

晶片尺寸/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

XY解析度/XY Resolution

0.02mil0.5μm

6.適用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

 ±30°

支架長度/Length

80-170mm

最大晶片環尺寸/Max. Die Ring Size

6″(152mm)外徑(External Diameter)

支架寬度/Width

45-75mm

最大晶片面積尺寸/Max. Die Area

4.7″(119mm)擴張後(Expanded)

7.所需設施/Facilities Needed

解析度/Resolution Ratio

0.04mil  (1μm)

電壓/頻率/Voltage/Frequency

220V AC±5%/50HZ

頂針Z高度行程/Thimble Z Height Stroke

80mil2mm

壓縮空氣/Compressed Air

0.5MPaMIN

額定功率/Rated Power

1300W

3.圖像識別系統/Image Recognition System

耗氣量/Gas Consumption

5L/min

灰階度/Grey Scale

256級灰度(Level Grey)

8.體積及重量/Volume and Weight

解析度/Resolution

656×492圖元(Pixels)

xx/Length x Width x Height

249×93×195cm

圖像識別精准度/Image Recognition Accuracy

±0.025mil@50mil觀測範圍(Observation Range)

重量/Weight

1700kg

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