GS128V
直插式高速固晶機
(週期:145ms)
適用於鐵、銅垂直LED
一、機型特性
1.長短引線垂直式LED燈全自動固晶的最佳選擇;
2.垂直式LED燈高速固晶(145ms/顆,每小時產量為22K)、精准的自動化設備為企業提高生產效率、降低成本提供了有效保障,從而切實有效地提高了企業競爭力;
4.採用直驅電機驅動邦頭;
5.採用線性電機驅動晶片搜尋(X/Y)平臺與送料B/C)平臺
6.採用可程式恒溫點膠系統;
7.採用機械進料系統,避免氣壓不穩定造成進料不順;
8.採用新式吸料機構,銅鐵支架切換只需簡單調節;
9.採用真空漏晶檢測;
10.工控機控制設備運行,簡化了自動化設備的操作。
GS128V
Direct Insert-type High-speed Die Bonder
Cycle: 145ms
It can be applied to iron and copper vertical LED products.
Product Features
1. It is the best choice for full-automation die bond of long and short lead vertical LED light;
2. Vertical LED high-speed die bond (145ms/piece, 22K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
3. Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies;
4. Linear motor is applied to drive bond head;
5. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
6. Programmed control constant-temperature adhesive dispensing system is also applied;
7. Mechanical loading system is applied to avoid unsmooth loading caused by unstable air pressure;
8. With the new suction mechanism, the switching of the copper-iron holder just need simple adjustment;
9. Vacuum die missing testing technology is adopted;
10. IPC will control the operation of equipment, simplifying
the operation of automation equipment.
二、規格參數
Specifications and Parameters
1.系統功能/System Function
4.圖像識別系統/Image Recognition System
生產週期/Production Cycle
145ms(取決於晶片尺寸及支架)(Depending On Die Size And Holder)
灰階度/Grey Scale
256級灰度(Level Grey)
晶片尺寸/Die Dimensions
5mil×5mil-80mil×80mil
解析度/Resolution
512x512圖元(Pixel)
通用垂直引線框架尺寸/General
Vertical Lead Framework Dimensions
長/L
150mm-230mm
圖像識別精准度/Image Recognition Accuracy
±0.025mil@50mil觀測範圍(Observation
Range)
高/T
19mm-40mm
(可根據特殊尺寸設計)
(Customizable)
5.系統精准度/ System Accuracy
XY位置精度/Accuracy
±1.5mil(±0.038mm)
晶片旋轉/Die Rotation
±3°
厚/H
0.3mm-0.6mm
6.焊頭/Welding head
莭距/Pitch
4.5mm-15.5mm
吸晶擺臂/Swing Arm of Die Bonder
90°旋轉焊臂(Rotatable Welding Arm)
最多可容納物料/Materials Held at Most
4K-5K
吸晶壓力/Die Bond Pressure
可調20g -250g(Adjustable)
2. 晶片處理器/Die Processor
7.所需設施/Facilities
Needed
最大晶片環尺寸/Max. Die Ring Size
6.5″(165mm)外徑(External
Diameter)
電壓/頻率Voltage/Frequency
220V AC ±5% /
50HZ
壓縮空氣/Compressed Air
0.5MPa(MIN)
最大晶片面積尺寸/Max. Die Area
4.7″(119mm)擴張後(Expanded)
額定功率/Rated Power
700W
3.晶片工作臺/Die XY Workbench
耗氣量/Gas Consumption
5L/min
8.體積及重量/Volume
and Weight
解析度/Resolution Ratio
0.04mil(1μm)
長x寬x高/
Length x Width x Height
90x95x180cm
頂針Z高度行程/Thimble Z Height Stroke
80mil(2mm)
重量/Weight
515kg
(0.13mm*0.13mm-2mm*2mm)
首頁 | 公司介紹 | 產品服務 | 新聞資訊 | 聯系真人网络赌钱平台們