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GS850PD-C
Plane-type High-speed Die Bonder
Cycle: 200ms
It is compatible with flip-chip and COB
Product Features
1. International leading single die bond, single adhesive dispense and single die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Vacuum die missing testing technology is adopted;
5. Automatic loading and unloading system is applied to saving the time of reloading;
6. IPC will control the operation of equipment, simplifying the operation of automation equipment;
7. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
8. Precise die bond location and excellent compatibility will guarantee the back-end processing.
Specifications
and Parameters
1.系统功能/System Function
4、吸晶摆臂机械手系统/
Die Bonder’s Swing Arm-and-hand system
生产周期/Production Cycle
200ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)
吸晶摆臂/
Swing Arm of Die Bonder
180°旋转固晶
(Rotatable Die Bond)
XY位置精度/Accuracy
±1mil(±0.025mm）
吸晶压力/Die Bond Pressure
可调20g—250g(Adjustable)
芯片旋转/Die Rotation
±3°
5.送料工作平台/Loading Workbench
2.芯片XY工作台/Die XY Workbench
行程范围/Range of Stroke
230mm*150mm
芯片尺寸/Die Dimensions
4mil×4mil-80mil×80mil
XY分辨率/XY Resolution
0.02mil(0.5μm)
6.适用支架尺寸/Suitable Holder’s Size
晶片最大角度修正/Max. Angle Correction
±15°
支架长度/Length
120mm -230mm
最大芯片环尺寸/Max. Die Ring Size
8″（212mm）外径(External Diameter)
支架宽度/Width
60mm- 150mm
最大芯片面积尺寸/Max. Die Area
6.5″（165mm）扩张后(Expanded)
7.所需设施/Facilities Needed
分辨率/Resolution Ratio
0.04mil (1μm)
电压/频率/Voltage/Frequency
220V AC±5%/50HZ
顶针Z高度行程/Thimble Z Height Stroke
80mil（2mm）
压缩空气/Compressed Air
0.5MPa（MIN）
额定功率/Rated Power
700W
3.图像识别系统/Image Recognition System
耗气量/Gas Consumption
5L/min
灰阶度/Grey Scale
256级灰度(Level Grey)
8.体积及重量/Volume and Weight
分辨率/Resolution
640×480像素(Pixels)
长x宽x高/Length x Width x Height
102×130×170cm
图像识别精准度/Image Recognition Accuracy
±0.025mil@50mil观测范围(Observation Range)
重量/Weight
740kg
(0.1mm*0.1mm-2mm*2mm)
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