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GS128V
Direct Insert-type High-speed Die Bonder
Cycle: 145ms
It can be applied to iron and copper vertical LED products.
Product Features
1. It is the best choice for full-automation die bond of long and short lead vertical LED light;
2. Vertical LED high-speed die bond (145ms/piece, 22K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
3. Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies;
4. Linear motor is applied to drive bond head;
5. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
6. Programmed control constant-temperature adhesive dispensing system is also applied;
7. Mechanical loading system is applied to avoid unsmooth loading caused by unstable air pressure;
8. With the new suction mechanism, the switching of the copper-iron holder just need simple adjustment;
9. Vacuum die missing testing technology is adopted;
10. IPC will control the operation of equipment, simplifying the operation of automation equipment.
Specifications
and Parameters
1.系统功能/System Function
4.图像识别系统/Image Recognition System
生产周期/Production Cycle
145ms(取决于晶片尺寸及支架）(Depending On Die Size And Holder)
灰阶度/Grey Scale
256级灰度（Level Grey）
芯片尺寸/Die Dimensions
5mil×5mil-80mil×80mil
分辨率/Resolution
512x512像素(Pixel)
通用垂直引线框架尺寸/General Vertical Lead Framework
Dimensions
长/L
150mm-230mm
图像识别精准度/Image
Recognition Accuracy
±0.025mil@50mil观测范围(Observation Range)
高/T
19mm-40mm
（可根据特殊尺寸设计）
(Customizable)
5.系统精准度/ System Accuracy
XY位置精度/Accuracy
±1.5mil(±0.038mm）
芯片旋转/Die Rotation
±3°
厚/H
0.3mm-0.6mm
6.焊头/Welding head
莭距/Pitch
4.5mm-15.5mm
吸晶摆臂/Swing Arm of
Die Bonder
90°旋转焊臂(Rotatable Welding Arm)
最多可容纳物料/Materials Held at Most
4K-5K
吸晶压力/Die Bond
Pressure
可调20g -250g(Adjustable)
2. 芯片处理器/Die Processor
7.所需设施/Facilities Needed
最大芯片环尺寸/Max. Die Ring Size
6.5″(165mm)外径(External Diameter)
电压/频率Voltage/Frequency
220V AC ±5%
/ 50HZ
压缩空气/Compressed Air
0.5MPa（MIN）
最大芯片面积尺寸/Max. Die Area
4.7″(119mm)扩张后(Expanded)
额定功率/Rated Power
700W
3.芯片工作台/Die XY Workbench
耗气量/Gas Consumption
5L/min
8.体积及重量/Volume and Weight
分辨率/Resolution Ratio
0.04mil(1μm)
长x宽x高/
Length x Width x Height
90x95x180cm
顶针Z高度行程/Thimble Z Height Stroke
80mil(2mm)
重量/Weight
515kg
(0.13mm*0.13mm-2mm*2mm)
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