It is compatible with
the printed solder paste COB, PCB die bond
Product Features
1.It is the best choice for the printed solder paste COB, PCB automatic die
bond;
2.The cycle of die bond is 300ms/ piece, 12K UPH, sophisticated equipment
will help improve your enterprise’s production efficiency and reduce relevant
costs so as to provide effective guarantee and enhance the enterprise’s
competitiveness;
3.Precise die bond location and excellent compatibility will guarantee the
back-end processing; meanwhile, precise die bond location will also guarantee
the high quality of LED products;
4.The left
loading and right unloading method made it convenient for line production;
5.Linear motor is applied to drive bond head;
6.Linear motor will drive the die to search corresponding platform(X/Y) and
corresponding loading platform (B/C);
7.Vacuum die missing testing technology is adopted;
8.IPC will control the operation of equipment, simplifying the operation of
automation equipment.
Specifications
and Parameters
1.系统功能/System Function
4.吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand system
生产周期
/Production Cycle
240ms（取决于晶片尺寸及支架）(Depending On Die Size And Holder)
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