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HAD205-PDCO
    Publish time 2019-07-18 17:05    

HAD205-P

Screen Printing Machine

Cycle: 60ms

It is compatible with SMD optocoupler etc.

 

Product Features

To the consistency of the glue amount/ the controlling of weld layer void, the cementing possess obvious advantages over dispending and sticking way 

Sturdy and heavy mechanism/ micro-adjustable stencil seat to ensure the relative level of the platform and the stencil

 

Data processing capabilities:

1.      Real time detection table display of the solder paste mark position/ size, auto-shutdown alarming system if position/size exceeds the upper and lower limits;

2.      Solder paste mark position/ size data preservation for querying anytime;

3.      Solder paste mark position/ size data statistics function, such as cpk.;

4.      Solder paste mark position/ size data detection results generate mapping for die attaching.

 

Specifications and Parameters

 

1.系统功能/System Function

生产周期/Production Cycle

60ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

25-30s/ 1pcs 支架/holder

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mm*300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150mm~ 300mm

支架宽度/Width

50mm~ 100mm

4.所需设施/Facilities Needed

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

500W

耗气量/Gas Consumption

5L/min

5.体积及重量/Volume and Weight

xx/Length x Width x Height

139×85×180cm

重量/Weight

800kg

6.图像识别系统/Image Recognition System

灰阶度/Grey Scale

256级灰度(Level Grey)

分辨率/Resolution

656×492像素(Pixels)

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

 


HAD205-D

Plane-type High-speed Die Bonder

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1.      International leading double die bond and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Automatic chip theta alignment system is applied on the Crystal frame;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

9.      Precise die bond location and excellent compatibility will guarantee the back-end processing.

 

Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/

Die Bonder’s Swing Arm-and-hand system

生产周期/Production Cycle

60ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/

Swing Arm of Die Bonder

双摆臂126°可旋转固晶(Rotatable Die Bond with Double Swing Arms)

XY位置精度/Accuracy (带芯片校正功能/ With Die Correcting Feature)

±1mil(±0.025mm

吸晶压力/

Die Bond Pressure

可调20g250g(Adjustable)

芯片旋转/Die Rotation

±1°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围/

Range of Stroke

100mm*300mm

芯片尺寸/

Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2.0mm*2.0mm)

XY分辨率/

XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

360°

支架长度/Length

150mm ~ 300mm

最大芯片环尺寸/

Max. Die Ring Size

6″与7″可选(Optional)

支架宽度/Width

50mm~ 100mm

最大芯片面积尺寸/Max. Die Area

4″(101mm)、5″(127mm

7.所需设施/Facilities Needed

分辨率/

Resolution Ratio

0.04mil  (1μm)

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程/Thimble Z Height Stroke

80mil2mm

压缩空气/

Compressed Air

0.5MPaMIN

额定功率/Rated Power

1000W

3.图像识别系统/Image Recognition System

耗气量/

Gas Consumption

5L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656×492像素(Pixels)

xx/

Length x Width x Height

192×85×180cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

重量/Weight

1250kg

 

 

HAD205-C

Clip and Cutting Machine

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1.      Die Dispensing

Stable mechanism design; Dispensing module can adapt to your holder; there are up to 4 sets of dispensing needles, which improved the dispensing efficiency greatly, each group of dispensing mechanism X / Y / Z direction are adjustable which facilitates debugging and maintenance;

2, Clip Attaching

The cutting burr is less than 0.05mm with the high-precision die-cutting mold; the tool life can reach to 2kk times; the clip bond force parameterization can protect the chip from damage.

Data processing capabilities:

a, Real time detection table display of the dispensing mark and clip mounting mark position/ size, auto-shutdown alarming system if position/size exceeds the upper or lower limits;

b, Dispensing mark and clip mounting mark position/ size data preservation for querying anytime;

c, Dispensing mark and clip mounting mark position/ size data statistics function, such as cpk.;

d, Dispensing mark and clip mounting mark position/ size data detection results generate mapping for die attaching.

 

Specifications and Parameters

 

1.系统功能/System Function

生产周期/Production Cycle

60ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mm*300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150mm ~ 300mm

支架宽度/Width

50mm~ 100mm

4.所需设施/Facilities Needed

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

1000W

耗气量/Gas Consumption

5L/min

5.体积及重量/Volume and Weight

xx/Length x Width x Height

150×95×180cm

重量/Weight

1000kg

6.图像识别系统/Image Recognition System

灰阶度/Grey Scale

256级灰度(Level Grey)

分辨率/Resolution

656×492像素(Pixels)

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围(Observation Range)

 

 

HAD205-O

Reflow Oven

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1. Capacity is 10~30 Sec. per piece (as recommended Profile by solder paste)

2. Low power consumption (26KW when warming up/2KW when keep warming); low gas consumption (100 liters/min)

3. No oxidation welding (nitrogen or nitrogen-hydrogen mixture), oxygen content below 20ppm

4. The temperature difference is less than 5 ?C in the same temperature zone

5. Programmable temperature curve setting

6. Instant temperature monitoring

7. Unloaded web transfer mechanism

Superiority

1. Lampblack treatment: Electrostatic lampblack collection, the exhaust gas generated during reflow soldering can be directly discharged indoors after being treated;

2. The cycle of furnace cavity cleaning and maintenance: Depending on the quality/component of the solder paste, such as indium no-clean solder paste which needs to clean the inner cavity once a week;

3. Automatic profile function: the system can generate the furnace temperature curve automatically and preserve the data for querying anytime;

4. Furnace cover heating: The furnace cover is equipped with heating function to preserve the welding oil from condense on the furnace cover.

5. Heating rod: the high-quality heating rod is adopted which can ensure that the actual measurement of the highest temperature minus the lowest temperature in each temperature zone is less than or equal to 5.

 

Specifications and Parameters

 

1.系统功能/System Function

生产周期/Production Cycle

60ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

2.送料工作平台/Loading Workbench

行程范围/Range of Stroke

100mm*300mm

3.适用支架尺寸/Suitable Holder’s Size

支架长度/Length

150mm ~ 300mm

支架宽度/Width

50mm~ 100mm

4.所需设施/Facilities Needed

电压/频率/Voltage/Frequency

380V AC±5%/50HZ

压缩空气/Compressed Air

0.5MPaMIN

额定功率/Rated Power

32000W

耗气量/Gas Consumption

5L/min

5.体积及重量/Volume and Weight

xx/Length x Width x Height

210×120×150cm

重量/Weight

1200kg

6.温度/Temperature

范围/Range

0400

7.水流量及水温/Water Flow and Temperature

水流量/Water Flow

5L / Min

水溫/Water Temperature

15~20?C

8.适用气体 Suitable Gas

N2/H2=93%/7% or N2 only

 


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