HAD205-P
（週期：60ms）

適用於貼片光耦等

一、機型特性

刷膠工藝對膠量一致性/焊層viod控制較點膠和沾膠有明顯的優越性

堅固厚重的機構/網板座的可微調整設計，保證平臺和網板的相對水準

資料處理能力：；

1，錫膏點位置/大小即時檢測表格顯示，位置/大小超出上下限報警停機

2，錫膏點位置/大小資料保存可追蹤查詢；

3，錫膏點位置/大小資料統計功能，如cpk ；

4，錫膏點位置/大小資料檢測結果生成mapping供die attaching使用。

 

HAD205-P

Screen Printing Machine

Cycle: 60ms

It is compatible with SMD optocoupler etc.

 

Product Features

To the consistency of the glue amount/ the controlling of weld layer void, the cementing possess obvious advantages over dispending and sticking way 

Sturdy and heavy mechanism/ micro-adjustable stencil seat to ensure the relative level of the platform and the stencil

 

Data processing capabilities:

1.      Real time detection table display of the solder paste mark position/ size, auto-shutdown alarming system if position/size exceeds the upper and lower limits;

2.      Solder paste mark position/ size data preservation for querying anytime;

3.      Solder paste mark position/ size data statistics function, such as cpk.;

4.      Solder paste mark position/ size data detection results generate mapping for die attaching.

  

二、規格參數

Specifications and Parameters

 

1.系統功能/System Function
生產週期/Production Cycle	60ms（取決於晶片尺寸及支架）(Depending On Die Size And Holder) （25-30s/ 1pcs 支架/holder）
2.送料工作平臺/Loading Workbench
行程範圍/Range of Stroke	100mm*300mm
3.適用支架尺寸/Suitable Holder’s Size
支架長度/Length	150mm~ 300mm
支架寬度/Width	50mm~ 100mm
4.所需設施/Facilities Needed
電壓/頻率/Voltage/Frequency	220V AC±5%/50HZ
壓縮空氣/Compressed Air	0.5MPa（MIN）
額定功率/Rated Power	500W
耗氣量/Gas Consumption	5L/min
5.體積及重量/Volume and Weight
長x寬x高/Length x Width x Height	139×85×180cm
重量/Weight	800kg
6.圖像識別系統/Image Recognition System
灰階度/Grey Scale	256級灰度(Level Grey)
解析度/Resolution	656×492圖元(Pixels)
圖像識別精准度/Image Recognition Accuracy	±0.025mil@50mil觀測範圍(Observation Range)

 

 
HAD205-D

（週期：60ms）

適用於印刷錫膏後的貼片光耦等

一、機型特性

1.採用國際領先的雙固晶，雙晶片搜尋系統；

2.採用直驅電機驅動邦頭

3.採用線性電機驅動搜尋晶片平臺（X/Y）與送料平臺（B/C）

4. 晶框採用自動角度修正系統；

5.採用真空漏晶檢測；

6. 採用自動式上下晶環、自動接駁台結構，有效提高了生產效率；

7. 工控機控制設備運行，簡化了自動化設備的操作；

8.精准的設備化設備為企業提高生產效率，降低成本提供了有效保障，從而切實有效地提高了企業競爭力；

9. 精准的固晶位置及優良的一致性為後道工序提供了先天的保障

 

HAD205-D

Plane-type High-speed Die Bonder

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1.      International leading double die bond and double die searching system;

2.      Linear motor is applied to drive bond head;

3.      Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

4.      Automatic chip theta alignment system is applied on the Crystal frame;

5.      Vacuum die missing testing technology is adopted;

6.      Automatic up & down crystal rings and automatic inspection conveyor system is applied to improve the production efficiency largely;

7.      IPC will control the operation of equipment, simplifying the operation of automation equipment;

8.      Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

9.      Precise die bond location and excellent compatibility will guarantee the back-end processing.

  

二、規格參數

Specifications and Parameters

1.系統功能/System Function		4、吸晶擺臂機械手系統/ Die Bonder’s Swing Arm-and-hand system
生產週期/Production Cycle	60ms（取決於晶片尺寸及支架）(Depending On Die Size And Holder)	吸晶擺臂/ Swing Arm of Die Bonder	雙擺臂126°可旋轉固晶(Rotatable Die Bond with Double Swing Arms)
XY位置精度/Accuracy (帶晶片校正功能/ With Die Correcting Feature)	±1mil(±0.025mm）	吸晶壓力/ Die Bond Pressure	可調20g—250g(Adjustable)
晶片旋轉/Die Rotation	±1°	5.送料工作平臺/Loading Workbench
2.晶片XY工作臺/Die XY Workbench		行程範圍/ Range of Stroke	100mm*300mm
晶片尺寸/ Die Dimensions	5mil×5mil-80mil×80mil (0.13mm*0.13mm-2.0mm*2.0mm)	XY解析度/ XY Resolution	0.02mil（0.5μm）
		6.適用支架尺寸/Suitable Holder’s Size
晶片最大角度修正/Max. Angle Correction	360°	支架長度/Length	150mm ~ 300mm
最大晶片環尺寸/ Max. Die Ring Size	6″與7″可選(Optional)	支架寬度/Width	50mm~ 100mm
最大晶片面積尺寸/Max. Die Area	4″（101mm）、5″（127mm）	7.所需設施/Facilities Needed
解析度/ Resolution Ratio	0.04mil  (1μm)	電壓/頻率/Voltage/Frequency	220V AC±5%/50HZ
頂針Z高度行程/Thimble Z Height Stroke	80mil（2mm）	壓縮空氣/ Compressed Air	0.5MPa（MIN）
		額定功率/Rated Power	1000W
3.圖像識別系統/Image Recognition System		耗氣量/ Gas Consumption	5L/min
灰階度/Grey Scale	256級灰度(Level Grey)	8.體積及重量/Volume and Weight
解析度/Resolution	656×492圖元(Pixels)	長x寬x高/ Length x Width x Height	192×85×180cm
圖像識別精准度/Image Recognition Accuracy	±0.025mil@50mil觀測範圍(Observation Range)	重量/Weight	1250kg

 

HAD205-C

（週期：60ms）

適用於印刷錫膏後的貼片光耦等

一、機型特性

1，Die dispensing

穩固的機構設計；點膠模組可擴展性適應客戶支架；高達4組點膠針頭，大大提高了點膠效率，每組點膠機構X/Y/Z向可調整方便調試維護；

2，Clip attaching

高精密度沖切模具可保證切口毛刺小於0.05mm；刀具壽命可達2kk次；clip bond force參數化設定可保證晶片不受損

資料處理能力：

a，點膠點和Clip安裝點位置/大小即時檢測表格顯示，位置/大小超出上下限報警停機

b，點膠點和Clip安裝點位置/大小資料保存可追蹤查詢

c，點膠點和Clip安裝點位置/大小資料統計功能，如cpk

d，點膠點和Clip安裝點位置/大小資料檢測結果生成mapping供die attaching使用

 

HAD205-C

Clip and Cutting Machine

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1.      Die Dispensing

Stable mechanism design; Dispensing module can adapt to your holder; there are up to 4 sets of dispensing needles, which improved the dispensing efficiency greatly, each group of dispensing mechanism X / Y / Z direction are adjustable which facilitates debugging and maintenance;

2, Clip Attaching

The cutting burr is less than 0.05mm with the high-precision die-cutting mold; the tool life can reach to 2kk times; the clip bond force parameterization can protect the chip from damage.

Data processing capabilities:

a, Real time detection table display of the dispensing mark and clip mounting mark position/ size, auto-shutdown alarming system if position/size exceeds the upper or lower limits;

b, Dispensing mark and clip mounting mark position/ size data preservation for querying anytime;

c, Dispensing mark and clip mounting mark position/ size data statistics function, such as cpk.;

d, Dispensing mark and clip mounting mark position/ size data detection results generate mapping for die attaching.

 

二、規格參數

Specifications and Parameters

1.系統功能/System Function
生產週期/Production Cycle	60ms（取決於晶片尺寸及支架）(Depending On Die Size And Holder)
2.送料工作平臺/Loading Workbench
行程範圍/Range of Stroke	100mm*300mm
3.適用支架尺寸/Suitable Holder’s Size
支架長度/Length	150mm ~ 300mm
支架寬度/Width	50mm~ 100mm
4.所需設施/Facilities Needed
電壓/頻率/Voltage/Frequency	220V AC±5%/50HZ
壓縮空氣/Compressed Air	0.5MPa（MIN）
額定功率/Rated Power	1000W
耗氣量/Gas Consumption	5L/min
5.體積及重量/Volume and Weight
長x寬x高/Length x Width x Height	150×95×180cm
重量/Weight	1000kg
6.圖像識別系統/Image Recognition System
灰階度/Grey Scale	256級灰度(Level Grey)
解析度/Resolution	656×492圖元(Pixels)
圖像識別精准度/Image Recognition Accuracy	±0.025mil@50mil觀測範圍(Observation Range)

 

 

HAD205-O

（週期：60ms）

適用於印刷錫膏後的貼片光耦等

一、機型特性

1.產能 = 10~30 Sec. / 每一片(按錫膏商建議的Profile)

2.低耗電（升溫時26KW/保溫時2KW）；低耗氣(100升/分)

3.無氧化焊接 (氮氣或氮氫混合氣)，含氧量20ppm以下

4.同一溫區 溫差小於5?C

5.可程式化之溫度曲線設定

6.即時溫度監控

7.不卡料之料片傳送機構

二、優越性：

1.油煙處理 : 靜電式油煙收集方式，回流焊接時產生之廢氣經處理後可直排室內

2.爐內腔體清潔保養週期 : 依錫膏品質/成份不同而異，如indium免清洗錫膏可一周清潔一次爐內腔體

3.自動profile功能：系統可自動產生爐溫曲線，並可保存查詢

4.爐蓋加熱：爐蓋備有加熱功能，保證焊油不在爐蓋上凝聚

5.加熱棒：選用高品質加熱棒，保證同一溫區各點實測最高溫減最低溫小於或等於5℃

 

HAD205-O

Reflow Oven

Cycle: 60ms

It is compatible with solder paste printed SMD optocoupler etc.

 

Product Features

1. Capacity is 10~30 Sec. per piece (as recommended Profile by solder paste)

2. Low power consumption (26KW when warming up/2KW when keep warming); low gas consumption (100 liters/min)

3. No oxidation welding (nitrogen or nitrogen-hydrogen mixture), oxygen content below 20ppm

4. The temperature difference is less than 5 ?C in the same temperature zone

5. Programmable temperature curve setting

6. Instant temperature monitoring

7. Unloaded web transfer mechanism

Superiority

1. Lampblack treatment: Electrostatic lampblack collection, the exhaust gas generated during reflow soldering can be directly discharged indoors after being treated;

2. The cycle of furnace cavity cleaning and maintenance: Depending on the quality/component of the solder paste, such as indium no-clean solder paste which needs to clean the inner cavity once a week;

3. Automatic profile function: the system can generate the furnace temperature curve automatically and preserve the data for querying anytime;

4. Furnace cover heating: The furnace cover is equipped with heating function to preserve the welding oil from condense on the furnace cover.

5. Heating rod: the high-quality heating rod is adopted which can ensure that the actual measurement of the highest temperature minus the lowest temperature in each temperature zone is less than or equal to 5℃.

三、規格參數：

Specifications and Parameters

 

1.系統功能/System Function
生產週期/Production Cycle	60ms（取決於晶片尺寸及支架）(Depending On Die Size And Holder)
2.送料工作平臺/Loading Workbench
行程範圍/Range of Stroke	100mm*300mm
3.適用支架尺寸/Suitable Holder’s Size
支架長度/Length	150mm ~ 300mm
支架寬度/Width	50mm~ 100mm
4.所需設施/Facilities Needed
電壓/頻率/Voltage/Frequency	380V AC±5%/50HZ
壓縮空氣/Compressed Air	0.5MPa（MIN）
額定功率/Rated Power	32000W
耗氣量/Gas Consumption	5L/min
5.體積及重量/Volume and Weight
長x寬x高/Length x Width x Height	210×120×150cm
重量/Weight	1200kg
6.溫度/Temperature
範圍/Range	0～400℃
7.水流量及水溫/Water Flow and Temperature
水流量/Water Flow	5L / Min
水溫/Water Temperature	15~20?C
8.適用氣體 Suitable Gas
N2/H2=93%/7% or N2 only