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HAD816-B全自动高速固晶机
    发布时间: 2020-09-09 18:24    

HAD816-B(全自动高速固晶机)

(周期: 120ms

适合于矩阵式粘胶工艺的IC支架,如DFN/QFN系列、SOP系列


一、机型特性

1.点胶模组可扩展性适应客户支架;高达4组点胶针头,大大提高了点胶效率,每组点胶机构X/Y/Z向可调整方便调试维护;

2.采用线性电机驱动搜寻晶片平台(X/Y)与送料平台(B/C);

3.wafer table自动校正芯片位置;

4.自主研发工控机控制系统,简单易操作&维护;

5.流量式芯片真空检测,稳定可靠;

6.自主研发视觉系统for pre-bond/pos-bond,稳定可靠;

7.材料/产品的全自动载入载出,高生产效率的保证;

8.固晶位置精准及优良的一致性,高品质产品的保证;

9.节拍:120毫秒/点,实际产出取决于芯片尺寸和支架上产品的密集度;

10.bondforce参数化调整,稳定可靠。

HAD816-BAutomatic High-speed Die Bonder

Cycle: 120ms

It is compatible with IC leadframe of matrix viscose process, such as DFN/QFN series, SOP series.


Model Features

1. The dispensing module is expandable to adapt to customer support; up to 4 sets of dispensing needles, greatly improving the efficiency of dispensing. The Dispensing mechanism of each set can be adjusted in X/Y/Z direction for convenient debugging and maintenance.

2. Using linear motor to drive the search chip platform (X/Y) and the feeding platform (B/C);

3. Wafer table automatically corrects the position of the chip;

4. Independently developed industrial computer control system, easy to operate and maintain;

5. Flow type chip vacuum detection, stable and reliable;

6. Independently developed visual system for pre-bond/ pos-bond, stable and reliable;

7. Fully automatic loading and unloading of materials/products, ensuring high production efficiency;

8. Precise location of die bonding and excellent consistency, guarantee high quality products;

9. Beat: 120 ms/point, actual output depends on chip size and density of products on the bracket;

10. Bondforce parameterized adjustment, stable and reliable.



二、规格参数/Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/Die Bonder’s Swing Arm-and-hand system

生产周期

/Production Cycle

120ms(取决于晶片尺寸及支架)(Depending On Die Size And Holder)

吸晶摆臂/Swing Arm of Die Bonder

bondforce参数化调整

固晶精度/Accuracy

±1mil(±0.025mm

吸晶压力

/Die Bond Pressure

可调20g-250g

(Adjustable)

芯片旋转/Die Rotation

±3°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围

/Range of Stroke

300mm*100mm

芯片尺寸

/Die Dimensions

5mil×5mil-90mil×90mil
(0.13mm*0.13mm-2.3mm*2.3mm)

XY分辨率

/XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正/Max. Angle Correction

±180°

支架长度/Length

150mm~ 300mm(单粘胶可做小于150mm支架)

最大芯片环尺寸/Max. Die Ring Size

10″(254mm)外径  铁环(External Diameter) Iron Ring

支架宽度/Width

50mm~ 100mm

最大芯片面积尺寸/Max. Die Area

8(Expanded)

7.所需设施/Facilities Needed

分辨率

/Resolution Ratio

1μm

电压/频率/Voltage/Frequency

220V AC±5%/50HZ

顶针Z高度行程

/Thimble Z Height Stroke

160mil4mm

压缩空气

/Compressed Air

0.5MPaMIN

额定功率/Rated Power

930W

3.图像识别系统/Image Recognition System

耗气量

/Gas Consumption

40L/min

灰阶度/Grey Scale

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率/Resolution

656X492像素(Pixels)

xx/Length x Width x Height

220X120X155(不含显示器)cm

图像识别精准度/Image Recognition Accuracy

±0.025mil@50mil观测范围

(Observation Range)

重量/Weight

1300kg

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