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HAD2610平面式高速固晶机
    发布时间: 2020-09-09 18:26    

HAD2610(平面式高速固晶机)

(周期:130ms

适用于普通贴片,二极管,三极管等


一、机型特性

1.采用国际领先的固晶,点胶,晶片搜寻系统;

2.单邦双臂结构,采用电机旋转+音圈上下驱动固晶摆臂;

3.采用丝杆伺服驱动搜寻晶片平台(X/Y)与线性电机驱动送料平台(B/C);

4.采用晶框自动校正晶片结构以及自动扩蓝膜结构,兼容6寸和8寸晶圆;

5.采用新式恒温点胶系统;

6.采用真空漏晶检测;

7.两种上料方式:叠料方式吸支架上料或料盒方式推支架进料,人性化操作,提高生产效率;

8、收料采用:料盒方式收料,有效提高了生产效率;

9、工控机控制设备运行,简化了自动化设备的操作;

10、精准的自动化设备为企业提高生产效率,降低成本提供了有效保障,从而切实有效地提高了企业竞争力;

11、固晶位置精准及优良的一致性为后道工序提供了先天的保障。

HAD2610Planar High-speed Die Bonder

Cycle: 130ms

Suitable for ordinary chip, diode, triode

Model Features

1. Adopt the international leading die-bonding, dispensing and wafer search system;

2. Single-bonder and double-arm structure, motor rotation + voice coil up and down to drive the solid-crystal swinging arm;

3. Using screw servo drive to search chip platform (X/Y) and linear motor drive feeding platform (B/C);

4. Adopt the crystal frame to automatically correct the wafer structure and automatically expand the blue film structure, compatible with 6-inch and 8-inch wafers;

5. Adopt the new constant temperature dispensing system;

6. Vacuum die missing test is adopted;

7. Two loading modes: stacking mode, suction bracket loading mode or material box mode, pushing bracket loading mode, humanized operation, improving production efficiency;

8. Material receiving: material box, effectively improving production efficiency;

9. IPC controls the operation of equipment, which simplifies the operation of automatic equipment;

10. Accurate automation equipment provides an effective guarantee for enterprises to improve production efficiency and reduce costs, thus effectively improving the competitiveness of enterprises;

11. Precise location and excellent consistency of die bonding provide innate guarantee for the later process.




二、规格参数/Specifications and Parameters

1.系统功能/System Function

4、吸晶摆臂机械手系统/Die Bonder’s Swing

Arm-and-hand System

生产周期

/Production Cycle

130ms(取决于晶片尺寸及支架密集度)

(Depending on Die Size and Holder Density)

吸晶摆臂

/Swing Arm of Die Bonder

180°可旋转固晶

(Rotatable Die Bond)

XY精度/Accuracy

±1mil(±0.025mm

吸晶压力

/Die Bond Pressure

可调20g250g

(Adjustable)

芯片旋转/Die Rotation

±3°

5.送料工作平台/Loading Workbench

2.芯片XY工作台/Die XY Workbench

行程范围

/Range of Stroke

250mm*75mm

芯片尺寸

/Die Dimensions

5mil×5mil-80mil×80mil
(0.13mm*0.13mm-2mm*2mm)

XY分辨率

/XY Resolution

0.02mil0.5μm

6.适用支架尺寸/Suitable Holder’s Size

晶片最大角度修正

/Max.Angle Correction

±15°

支架长度/Length

150 ~ 250mm

最大芯片环尺寸

Max.Die Ring Size

10″(254mm)外径  铁环

External Diameter Iron Ring

支架宽度/Width

28mm~ 75mm

最大芯片面积尺寸

/Max.Die Area

8″(210mm)扩张后

7.所需设施/Facilities Needed

分辨率

/Resolution Ratio

1μm

电压/频率

/Voltage/Frequency

220V AC±5%/50HZ

重复率

/Repetitive Rate

0.8μm

压缩空气

/Compressed Air

0.5MPaMIN

顶针Z高度行程

/Thimble Z Height Stroke

80mil2mm

额定功率

/Rated Power

950W

3.图像识别系统/Image Recognition System

耗气量

/Gas Consumption

40L/min

图像识别

/Image Recognition     

256级灰度(Level Grey)

8.体积及重量/Volume and Weight

分辨率

/Resolution

656X492像素(Pixels)

xx

/Length*Width*Height

135X120X175cm

图像识别精准度

/Image Recognition Accuracy

±0.025mil@50mil观测范围

(Scope of Observation)

重量

/Weight

1250kg

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