GT836M（平面式高速固晶机）

（周期：180ms）

适用于数码、点阵、大功率、COB、SMD等

一、机型特性

1.平面式LED灯全自动固晶的最佳选择；

2.高速固晶（180ms/颗，每小时产量为20K）、精准的自动化设备为企业提高生产效率、降低成本提供了有效保障，从而切实有效地提高了企业竞争力；

3. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障；

4.采用直驱电机驱动邦头；

5.采用全新接触式探测系统控制摆臂，有效解决了PCB板或支架高度不一致而导致的固晶问题；

6.采用线性电机驱动晶片搜寻平台（X/Y）与固晶平台（B/C）

7.采用可程式恒温点胶系统；

8.采用真空漏晶检测；

9. 工控机控制设备运行，简化了自动化设备的操作；

GT836M

Plane-type High-speed Die Bonder

Cycle: 180ms

It is compatible with digital products, dot matrix, high power, COB, and SMD etc.

Product Features

1.        It is the best choice for full-automation die bond of planar LED lights;

2.        High-speed die bond(180ms/piece, 20K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;

3.        Precise die bond location and excellent compatibility will guarantee the back-end processing;

4.        Linear motor is applied to drive bond head;

5.        New touch-type deep detection system is applied to control the swing arm, solving the bonding issues caused by the non-uniform height of PCB or holder effectively;

6.        Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);

7.        Programmed control constant-temperature adhesive dispensing system is also applied;

8.        Vacuum die missing testing technology is adopted;

9.        IPC will control the operation of equipment, simplifying the operation of automation equipment.

二、规格参数

Specifications and Parameters