GS128V
直插式高速固晶机
（周期：145ms）
适用于铁、铜垂直LED
一、机型特性
1.长短引线垂直式LED灯全自动固晶的最佳选择；
2.垂直式LED灯高速固晶（145ms/颗，每小时产量为22K）、精准的自动化设备为企业提高生产效率、降低成本提供了有效保障，从而切实有效地提高了企业竞争力；
3. 精准的固晶位置及优良的一致性为后道工序提供了先天的保障，同时固晶位置精准确保LED灯光斑的品质，良好焊接及漂亮光斑再加上优良晶片就构成了高品质LED产品；
4.采用直驱电机驱动邦头；
5.采用线性电机驱动晶片搜寻(X/Y)平台与送料B/C)平台；
6.采用可程式恒温点胶系统；
7.采用机械进料系统，避免气压不稳定造成进料不顺；
8.采用新式吸料机构，铜铁支架切换只需简单调节；
9.采用真空漏晶检测；
10.工控机控制设备运行，简化了自动化设备的操作。
GS128V
Direct Insert-type High-speed Die Bonder
Cycle: 145ms
It can be applied to iron and copper vertical LED products.
Product Features
1. It is the best choice for full-automation die bond of long and short lead vertical LED light;
2. Vertical LED high-speed die bond (145ms/piece, 22K UPH) and sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
3. Precise die bond location and excellent compatibility will guarantee the back-end processing; meanwhile, precise die bond location will also guarantee the high quality of LED lamp spot; thus, high-quality LED products will be created with excellent welding, elegant light spot and choiceness dies;
4. Linear motor is applied to drive bond head;
5. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
6. Programmed control constant-temperature adhesive dispensing system is also applied;
7. Mechanical loading system is applied to avoid unsmooth loading caused by unstable air pressure;
8. With the new suction mechanism, the switching of the copper-iron holder just need simple adjustment;
9. Vacuum die missing testing technology is adopted;
10. IPC will control the operation of equipment, simplifying the operation of automation equipment.
二、规格参数
Specifications and Parameters
|
1.系统功能/System Function |
4.图像识别系统/Image Recognition System |
||||
|
生产周期/Production Cycle |
145ms(取决于晶片尺寸及支架）(Depending On Die Size And Holder) |
灰阶度/Grey Scale |
256级灰度（Level Grey） |
||
|
芯片尺寸/Die Dimensions |
5mil×5mil-80mil×80mil |
分辨率/Resolution |
512x512像素(Pixel) |
||
|
通用垂直引线框架尺寸/General Vertical Lead Framework Dimensions |
长/L |
150mm-230mm |
图像识别精准度/Image Recognition Accuracy |
±0.025mil@50mil观测范围(Observation Range) |
|
|
高/T |
19mm-40mm （可根据特殊尺寸设计） (Customizable) |
5.系统精准度/ System Accuracy |
|||
|
XY位置精度/Accuracy |
±1.5mil(±0.038mm） |
||||
|
芯片旋转/Die Rotation |
±3° |
||||
|
厚/H |
0.3mm-0.6mm |
6.焊头/Welding head |
|||
|
莭距/Pitch |
4.5mm-15.5mm |
吸晶摆臂/Swing Arm of Die Bonder |
90°旋转焊臂(Rotatable Welding Arm) |
||
|
最多可容纳物料/Materials Held at Most |
4K-5K |
吸晶压力/Die Bond Pressure |
可调20g -250g(Adjustable) |
||
|
2. 芯片处理器/Die Processor |
7.所需设施/Facilities Needed |
||||
|
最大芯片环尺寸/Max. Die Ring Size |
6.5″(165mm)外径(External Diameter) |
电压/频率Voltage/Frequency |
220V AC ±5% / 50HZ |
||
|
压缩空气/Compressed Air |
0.5MPa（MIN） |
||||
|
最大芯片面积尺寸/Max. Die Area |
4.7″(119mm)扩张后(Expanded) |
额定功率/Rated Power |
700W |
||
|
3.芯片工作台/Die XY Workbench |
耗气量/Gas Consumption |
5L/min |
|||
|
8.体积及重量/Volume and Weight |
|||||
|
分辨率/Resolution Ratio |
0.04mil(1μm) |
长x宽x高/ Length x Width x Height |
90x95x180cm |
||
|
顶针Z高度行程/Thimble Z Height Stroke |
80mil(2mm) |
重量/Weight |
515kg |
||
真人网络赌钱平台 | 公司介绍 | 产品服务 | 新闻资讯 | 联系真人网络赌钱平台